64 ball FPGA breakout board

Your task is to create a KiCad library for the part LCMXO2-256ZE-1UMG64C and a KiCad footprint for it. On Digikey it is this part: [login to view URL] Then you create a breakout board for it, see the attached file [login to view URL] for an example how it should look like: The FPGA in the center, and then pin headers to break out every connected FPGA pad, and a label for each pin on the silkscreen. For the pad names see page 39 for 64-ball ucBGA : [login to view URL]~/media/LatticeSemi/Documents/PinPackage/[login to view URL] The pinout for the MachXO2-256, see this document, package UCBGA64: [login to view URL] The labels on the silkscreen must be from the column "Pin/Ball Function", but you must connect it to the pads listed in the "UCBGA64" column. For a recommended layout, see page 6 for 64-ball ucBGA: [login to view URL]~/media/LatticeSemi/Documents/ApplicationNotes/PT/[login to view URL] Requirements for the PCB: - min trace width / min space: 3 mil - min hole size: 4 mil - no via-in-pad - 4 layers VCCIO0, VCCIO1, VCCIO2 and VCCIO3 must be connected all to one VCCIO signal. Sanity check, if you bid for this project, to filter out all the bidders who have no clue and who bid on every project: unpack the [login to view URL], open it in KiCad and write me what challenge text you can read on the PCB. Any bids without the correct answer will be ignored.