Finalize ESP32-S3 Data Acquisition PCB

The core of the board is already in place: I have routed the ESP32-S3, its power stages, and footprints for a set of temperature sensors along with the basic peripherals. What remains is to turn this halfway-finished layout into a manufacture-ready design that cleanly captures sensor data, meets good signal-integrity practice, and is easy to assemble. Here is where the project stands: • Schematic up to date for the ESP32-S3, LDOs, USB-to-UART bridge, and four digital temperature sensors • Initial two-layer stack-up with partial ground pour and power planes • Footprints placed, but routing has not been done yet. • No final BOM, manufacturing drawings, What I need from you: 1. Review and refine the schematic to be sure every net required for clean sensor data acquisition is present and correctly decoupled. 2. Finish the PCB layout: optimise component placement, complete all routing, add proper pours, test points, and silkscreen. 3. Generate the full manufacturing package—Gerbers, drill files, pick-and-place, assembly notes, and a clean BOM. 4. Supply a minimal ESP-IDF project that confirms the board boots, enumerates the temperature sensors, and streams their readings over USB or Wi-Fi. Tooling: the current files are in KiCad 10; please stick with KiCad, documenting any library changes. Acceptance criteria • DRC and ERC pass with zero errors or warnings. • USB trace pair within ±10 % of 90 Ω differential impedance (document your calculation). • Board brings up first time with sensor data visible in a serial console demo. If this scope feels clear, let me know your typical turnaround for a board of this size and we can dive straight into the files.

Project ID: 40415574